电路板类英语词汇资料.docx
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电路板类英语词汇资料.docx
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电路板类英语词汇资料
AbieticAcid松脂酸.
AbrasionResistance耐磨性.
Abrasives磨料,刷材.
ABS树脂.
Absorption吸收(入).
AcImpedance交流阻抗.
AcceleratedTest(Aging)加速老化(试验).
Acceleration速化反应.
Accelerator加速剂,速化剂.
Acceptability,Acceptance允收性,允收.
AccessHole露出孔,穿露孔.
Accuracy准确度.
AcidNumber(AcidValue)酸值.
AcousticMicroscope(AM)感音成像显微镜.
Acrylic压克力(聚丙烯酸树脂).
ActinicLight(orIntensity,orRadiation)有效光.
Activation活化.
Activator活化剂.
ActiveCarbon活性炭.
ActiveParts(Devices)主动零件.
Acutance解像锐利度.
AdditionAgent添加剂.
AdditiveProcess加成法.
Adhesion附着力.
AdhesionPromotor附着力促进剂.
Adhesive胶类或接着剂.
Admittance导纳(阻抗的倒数).
Aerosol喷雾剂,气熔胶,气悬体.
Aging老化.
AirInclusion气泡夹杂.
AirKnife风刀.
Algorithm算法.
AliphaticSolvent脂肪族溶剂.
AluminiumNitride(AlN)氮化铝.
AmbientTamp环境温度.
Amorphous无定形,非晶形.
Amp-Hour安培小时.
AnalogCircuit/AnalogSignal模拟电路/模拟讯号.
AnchoringSpurs着力爪.
AngleofContack接触角.
AngleofAttack攻角.
Anion阴离子.
Anisotropic异向性,单向的.
Anneal韧化(退火).
AnnularRing孔环.
Anode阳极.
AnodeSludge阳极泥.
Anodizing阳极化.
ANSI美国标准协会.
Anti-FoamingAgent消泡剂.
Anti-pitAgent抗凹剂.
AOI自动光学检验.
Apertures开口,钢版开口.
AQL品质允收水准.
AQL(AcceptableQualityLevel)允收品质水准.
AramidFiber聚醯胺纤维.
ArcResistance耐电弧性.
Array排列.
Artwork底片.
ASIC特定用途绩体电路器.
AspectRatio纵横比.
Assembly组装装配.
A-stageA阶段.
ATE自动电测设备.
Attenuation讯号衰减.
Autoclave压力锅.
Axial-lead轴心引脚.
Azeotrope共沸混合液.
*****B*****
BackLight(BackLighting)背光法.
BackTaper反锥斜角.
Backpanels,Backplanes支撑板.
Back-up垫板.
BalancedTransmissionLines平衡式传输线.
BallGridArray球脚数组(封装).
Bandability弯曲性.
BankingAgent护岸剂.
BareChipAssembly裸体芯片组装.
Barrel孔壁,滚镀.
BaseMaterial基材.
BasicGrid基本方格.
Batch批.
Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr)
凡液体比重比水轻则Be=140÷(Sp.Gr-130)
*Sp.Gr为比重即同体绩物质对"纯水"1g/cm的比值).
Beamlead光芒式的平行密集引脚.
Bed-of-NailTesting针床测试.
BellowsConact弹片式接触.
BetaRayBackscatter贝他射线反弹散射.
Bevelling切斜边.
Bias斜张纲布,斜纤法.
Bi-LevelStencil]双阶式钢板.
Binder粘结剂.
Bits头(DrillBits).
BlackOxide黑氧化层.
Blanking冲空断开.
Bleack漂洗.
Bleeding溢流.
BlindViaHole肓通孔.
Blister局部性分层或起泡.
BlockDiagram电路系统块图.
Blockout封纲.
Blotting干印.
BlottingPaper吸水纸.
BlowHole吹孔.
BluePlaque蓝纹(锡面钝化层).
BlurEdge(Circle)模糊边带(圈).
BombSight弹标.
BondStrength结合强度.
Bondability结合性.
BondingLayer结合层接着层.
BondingSheet(Layer)接合片.
BondingWire结合线.
Bow,Bowing板弯.
Braid编线.
Brazing硬焊(用含银的铜锌合金焊条).
在425℃~870℃下进行熔接的方式).
BreakPoint显像点.
Break-awayPanel可断开板.
BreakdownVoltage崩溃电压.
Break-out破出.
Bridging搭桥.
BrightDip光泽浸渍处理.
Brightener光泽剂.
BrownOxide棕氧化.
BrushPlating刷镀.
B-stageB阶段.
BuildUpProcess增层法制程.
Build-up堆积.
Bulge鼓起.
Bump突块.
BumpingProcess凸块制程.
Buoyancy浮力.
BuriedViaHole埋导孔.
Burn-in高温加速老化试验.
Burning烧焦.
Burr毛头.
BusBar汇电杆.
ButterCoat外表树脂层.
*****C*****
C4ChipJointC4芯片焊接.
Cable电缆.
CAD计算机辅助设计.
CalenderedFabric轧平式纲布.
CapLamination帽式压合法.
Capacitance电容.
CapacitiveCoupling电容耦合.
CapillaryAction毛细作用.
Carbide碳化物.
CarbonArcLamp碳弧灯.
CarbonTreatment,Active活化炭处理.
Card卡板.
CardCages/CardRacks电路板构装箱.
CarlsonPin卡氏定位稍.
Carrier载体.
Cartridge滤心.
Castallation堡型绩体电路器.
CatalyzedBoard,CatalyzedSubstrate催化板材.
Catalyzing催化.
Cathode阴极.
Cation阴向离子,阳离子.
CaulPlate隔板.
Cavitation空泡化半真空.
Center-to-CenterSpacing中心间距.
Ceramics陶瓷.
Cermet陶金粉.
Certificate证明书.
CFC氟氢碳化物.
Chamfer倒角.
CharacteristicImpedance特性阻抗.
Chase纲框.
CheckList检查清单.
Chelate螯合.
ChemicalMilling化学研磨.
ChemicalResistance抗化性.
Chemisorption化学吸附.
Chip芯片(粒).
ChipInterconnection芯片互连.
ChiponBoard芯片粘着板.
ChipOnGlass晶玻接装(COG).
Chisel钻针的尖部.
ChlorinatedSolvent含氯溶剂,氯化溶剂.
CircumferentialSeparation环状断孔.
Clad/Cladding披覆.
CleanRoom无尘室.
Cleanliness清洁度.
Clearance余地,余环.
ClinchedLeadTerminal紧箝式引脚.
Clinched-wireThroughConnection通孔弯线连接法.
ClipTerminal绕线端接.
Coat,Coating皮膜表层.
CoaxialCable同轴缆线.
CoefficientofThermalExpansion热膨胀系数.
Co-Firing共绕.
ColdFlow冷流.
ColdSolderJoint冷焊点.
CollimatedLight平行光.
Colloid胶体.
ColumnarStructure柱状组织.
CombPattern梳型电路.
ComplexIon错离子.
ComponentHole零件孔.
ComponentOrientation零件方向.
ComponentSide组件面.
Composites,(CEM-1,CEM-3)复合板材.
CondensationSoldering凝热焊接,液化放热焊接.
Conditioning整孔.
Conductance导电.
ConductiveSalt导电盐.
Conductivity导电度.
ConductorSpacing导体间距.
ConformalCoating贴护层.
Conformity吻合性,服贴性.
Connector连接器.
ContactAngle接触角.
ContactArea接触区.
ContactResistance接触电阻.
Continuity连通性.
ContractService协力厂,分包厂.
ControlledDepthDrilling定深钻孔.
ConversionCoating转化皮膜.
Coplanarity共面性.
Copolymer共聚物.
CopperFoil铜皮.
CopperMirrorTest铜镜试验.
CopperPaste铜膏.
Copper-Invar-Copper(CIC)综合夹心板.
CoreMaterial内层板材,核材.
CornerCrack通孔断角.
CornerMark板角标记.
Counterboring方型扩孔.
Countersinking锥型扩孔.
CouplingAgent偶合剂.
Coupon,TestCoupon板边试样.
Coverlay/Covercoat表护层.
Crack裂痕.
Crazing白斑.
Crease皱折.
Creep潜变.
CrossectionArea截面积.
CrosshatchTesting十字割痕试验.
Crosshatching十字交叉区.
Crosslinking,Crosslinkage交联,架桥.
Crossover越交,搭交.
Crosstalk噪声,串讯.
CrystallineMeltingPoint晶体熔点.
C-StageC阶段.
Cure硬化,熟化.
CurrentDensity电流密度.
Current-CarryingCapability载流能力.
CurtainCoating濂涂法.
*****D*****
DaisyChainedDesign菊瓣设计.
DatumReference基准参考.
DaughterBoard子板.
Debris碎屑,残材.
Deburring去毛头.
DeclinationAngle斜射角.
Definition边缘逼真度.
Degradation劣化.
Degrasing脱脂.
DeionizedWater去离子水.
Delamination分离.
DendriticGrowth枝状生长.
Denier丹尼尔(是编织纺织所用各种纱类直径单位,
定义9000米纱束所具有的重量(以克米计)).
Densitomer透光度计.
Dent凹陷.
Deposition皮膜处理.
Desiccator干燥器.
Desmearing去胶渣.
Desoldering解焊.
Developer显像液,显像机.
Developing显像.
Deviation偏差.
Device电子组件.
Dewetting缩锡.
D-glassD玻璃.
DiazeFilm偶氮棕片.
Dichromate重铬酸盐.
Dicing芯片分割.
Dicyandiamide(Dicy)双氰胺.
Die冲模.
DieAttach晶粒安装.
DieBonding晶粒接着.
DieStamping冲压.
Dielectric介质.
DielectricBreakdownVoltage介质崩溃电压.
DielectricConstant介质常数.
DielectricStrength介质强度.
DifferentialScanningCalorimetry(DSC)微差扫瞄热卡分析法.
DiffusionLayer扩散层.
Digitizing数字化.
DihedralAngle双反斜角.
DimensionalStability尺度安定性.
Diode二极管.
DipCoating浸涂法.
DipSoldering浸焊法.
DIP(DualInlinePackage)双排脚封装体.
Dipole偶极,双极.
Direct/IndirectStencil直接/间接版膜.
DirectEmulsion直接乳胶.
DirectPlating直接电镀.
DiscreteCompenent散装零件.
DiscreteWiringBoard散线电路板,复线板.
DishDown碟型下陷.
Dispersant分散剂.
DissipationFactor散失因素.
DisspationFactor散逸因子.
DisturbedJoint受扰焊点.
DoctorBlade修平刀,刮平刀.
DogEar狗耳.
Doping掺杂.
DoubleLayer双电层.
DoubleTreatedFoil双面处理铜箔.
DragIn/DragOut带[进/带出.
DragSoldering拖焊.
Drawbridging吊桥效应.
Drift漂移.
DrillFacet钻尖切削面.
DrillPointer钻针重磨机.
DrilledBlank已钻孔的裸板.
Dross浮渣.
DrumSide铜箔光面.
DryFilm干膜.
DualWaveSoldering双波焊接.
Ductility展性.
DummyLand假焊垫.
Dummy,Dummying假镀(片).
Durometer橡胶硬度计.
DYCOstrate电浆蚀孔增层法.
DynamicFlex(FPC)动态软板.
*****E*****
E-Beam(ElectronBeam)电子束.
EddyCurrent涡电流.
EdgeSpacing板边空地.
Edge-BoardConnector板边(金手指)承接器.
Edge-BoardContact板边金手指.
Edge-DipSolderabilityTest板边焊锡性测试.
EDTA乙二胺四乙酸.
Effluent排放物.
E-glass电子级玻璃.
Elastomer弹性体.
ElectricStrength(耐)电性强度.
Electrodeposition电镀.
Electro-depositionPhotoresist电着光阻,电泳光阻.
Electroforming电铸.
Electroless-Deposition无电镀.
ElectrolyticToughPitch电解铜..
Electrolytic-Cleaning电解清洗.
Electro-migration电迁移.
Electro-phoresis电泳动,电渗.
Electro-tinning镀锡.
Electro-Winning电解冶炼.
Elongation延伸性,延伸率.
Embossing凸出性压花.
EMF(ElectromotiveForce)电动势.
EMI(ElectromagneticInterference)电磁干扰.
Emulsion乳化.
EmulsionSide药膜面.
Encapsulating胶囊.
Encroachment沾污,侵犯.
EndTap封头.
Entek有机护铜处理.
Entrapment夹杂物.
EntryMaterial盖板.
EpoxyResin环氧树脂.
EtchFactor蚀刻因子.
Etchant蚀刻剂(液).
Etchback回蚀.
EtchingIndicator蚀刻指针.
EtchingResist蚀刻阻剂.
EuteticComposition共融组成.
Exotherm放热(曲线).
Exposure曝光.
Eyelet铆眼.
*****F*****
Fabric纲布.
FaceBonding反面朝下结合.
Failure故障.
FanOutWiring/FanInWiring扇出布线/扇入布线.
Farad法拉.
Farady法拉第.
FatigueStrength抗疲劳强度.
Fault缺陷.
FaultPlane断层面.
FeedThroughHole导通孔.
Feeder进料器.
FiberExposure玻纤显露.
FiducialMark基准记号.
Filament纤丝.
Fill纬向.
Filler填充料.
Fillet内圆填角.
Film底片.
FilmAdhesive接着膜,粘合膜.
Filter过滤器.
FineLine细线.
FinePitch密脚距,密线距,密垫距.
Fineness粒度,纯度.
Finger手指.
Finishing终修(饰).
FiniteElementMethod有限要素分析法.
FirstArticle首产品.
FirstPass-Yield初检良品率.
Fixture夹具.
Flair刃角变形.
FlamePoint自燃点.
FlameResistant耐燃性.
FlammabilityRate燃性等级.
Flare扇形崩口.
FlashPlating闪镀.
Flashover闪络.
FlatCable扁平排线.
FlatPack扁平封装(之零件).
Flatness平坦度.
FlexiblePrintedCircuit(FPC)软板.
FlexuralFailure挠曲损坏.
FlexuralModule弯曲模数,抗挠性模数.
FlexuralStrength抗挠强度.
FlipChip覆晶,扣晶.
Flocculation絮凝.
FloodStrokePrint覆墨冲程印刷.
FlowSoldering(WaveSoldering)流焊.
Fluorescence荧光.
FlurocarbonResin碳氟树脂.
FlushConductor嵌入式线路,贴平式导体.
FlushPoint闪火点.
Flute退屑槽.
Flux助焊剂.
FoilBurr铜箔毛边.
FoilLamination铜箔压板法.
Foot残足(干膜残余物).
FootPrint(LandPattern)脚垫.
ForeignMaterial外来物,异物.
Form-to-List布线说明清单.
FourPointTwisting四点扭曲法.
FreeRadical自由基.
Freeboard干舷.
Frequency频率.
Frit玻璃熔料.
Fully-AdditiveProcess全加成法.
FungusResistance抗霉性.
FusedCoating熔锡层.
Fusing熔合.
FusingFluid助熔液.
*****G*****
G-10由连续玻纤所织成的玻纤布与
环氧树脂粘结剂所复合成的材料.
Gage,Gauge量规.
GalliumArsenide(GaAs)砷化镓.
GalvanicCorrosion贾凡尼式腐蚀(电解式腐蚀).
GalvanicSeries贾凡尼次序(电动次序).
Galvanizing镀锌.
GAP第一面分离,长刃断开.
GateArray闸列,闸极数组.
GelTime胶化时间.
GelationParticle胶凝点.
GerberData,GerberFile格博档案(是美商Gerber公司专为PCB面线路
图形与孔位,所发展一系列完整的软件档案).
GhostImage阴影.
Gilding镀金(现为:
GlodPlating).
GlassFiber玻纤.
GlassFiberProtrusion/Gouging,Groove玻纤突出/挖破.
GlassTransitionTemperature,Tg玻璃态转化温度.
Glaze釉面,釉料.
GlobTop圆顶封装体.
GloubleTest球状测试法.
Glycol(EthyleneGlycol)乙二醇.
GoldenBoard测试用标准板.
GrainSize结晶粒度.
GrassLeak大漏.
Grid标准格.
GroundPlane/EarthPlane接地层.
GroundPlaneClearance接地空环.
GuidePin导针.
Gull/WingLead鸥翼引脚.
*****H*****
Halation环晕.
HalfAngle半角.
Halide卤化物.
Haloing白圈,白边.
Halon海龙,是CFC"氟碳化物"的一种商品名.
HardAnodizing硬阳极化.
HardChromePlating镀硬铬.
HardSoldering硬焊.
Hardener(CuringAgent)硬化剂(或CuringAgent).
Hardness硬度.
Haring-BlumCell海固槽.
Harness电缆组合.
HayWire跳线.
HeatCleaning烧洁.
HeatDissipation散热.
HeatDistortionPoint(Temp)热变形点(温度).
HeatSealing热封.
HeatSinkPlane散热层.
HeatTransferPaste导热膏.
HeatsinkTool散热工具.
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