SMT测试.doc
- 文档编号:8775787
- 上传时间:2023-05-14
- 格式:DOC
- 页数:43
- 大小:337KB
SMT测试.doc
《SMT测试.doc》由会员分享,可在线阅读,更多相关《SMT测试.doc(43页珍藏版)》请在冰点文库上搜索。
SMT高級工程師教案
6
SMT測試
ATE工程師應注意及準備事項:
1.當拿到R/DCADFILES時,請在A-TEST導入時分析該被測試之TESTABILITY
2.在B-TEST導入ATE測試時,應注意版本變更之零件,規格;並分析下列資料:
名稱 數量
A.PCBCADFILES(NEWVER)1
B.BOM1
C.ARTWORK1
D.CIRCUIT1
E.BEARBOARD1-2
F.FUNCTIONM/B2-3
3.B-TEST後提出TESTABILITY報告.
A.列出A-TEST&B-TEST之異差
B.列出那些零件須加測試點及注意事項
C.列出治具要求之注意事項
D.列出LAYOUTTESTPAD及測試針之規格及注意事項
E.其它R/D設計須附合治具程式控制之要求
ATE工程師應注意及準備事項:
1.R/D在LAYOUT時之節點至少要有一測試點(TESTPAD)
2.線路途的每一測試點(TESTPAD),間距至少75MIL以上
3.手插零件不需加測試點,但如果是CONNECTOR很密之零件視需要加測試點.
4.CHIP除了空腳外,其餘各腳均需加測試點.
5.如果是單面之被測試時,測試點要均勻分佈於測試板.
6.如果是雙面之被測試時,測試點儘量LAYOUT在焊錫面.
7.測試點附近之零件高度應小於0.255IN(視產品而定)
8.測試點周圍0.018IN內不可有測試或零件
9.PCB邊緣0.125IN內不可有測試點
10.測試點到另一測試點不可小於0.083IN
.125°
.125°
.125°
PCBDEIGES
.125°
0.0827
2.1mm
(82.7mil)
MINIMUNDESIRABLETESTPADPOSITIONONG
.035”
(0.83MM)
11.所有導通孔及氣孔必須請PCB廠做MASK以防測試時漏氣
12.定位孔之定位針之尺寸誤差在+-.002IN
13.定位孔直徑大於0.012IN
14.定位孔之內壁不可吃錫
15.治具之定位孔要用CNC鑽孔
**測試零件CHIP,CONNECTOR為設計重點**
16.測試點不可被被綠漆蓋住(測試前用放大鏡檢查)
17.板邊至測試點約0.125IN不可有測試點.
PCBOARD
DATUMPOINT
TOL±.002
(.5mm)
TESTPAD
TOL±.002
(.5mm)
(.5mm)
TOL±.002
TOOLINF
HOLE
18.測試點直徑不小於0.35/0.50in(35mil),(目前約30mil)
Solderpad
(.09mm)
.035’
SOLDERRESIST
PROBETIP
19.導通孔之中心間距要150mil以上
20.各測試點必須吃錫,但邊緣不可被綠漆MASK
21.如考量功能測試時,要在CONNECTOR最進處加測試點
22.VCC點至少5點,GND點至少10點
以上為治具部份
23.對IC或CHIP之控制位址線(如RESET,ENABLE…)不可直接接到VCC或GROUND上
4.7K
NEORCL
24.測試盪器須先除頻或加JUMPER控制
10pf
VCC
25.對POWER-ONRESET在設計,要有隔離之設計
4.7K
RESET
0.1UF
VCC
VCC
4
1
4.7K
OUT
2
3
OSC
RESET
26.對振盪器如有控制ENABLE.DISABLE之產品測試會更穩,否則須加除頻電路或善用JUMP亦是一
個好方法
27.對IC或CHIP之OPTION空腳要LAYOUT測試點
28.BGA零件背面之PCB不可LAYOUT零件
■元件值
ICT■短路開路
-ICBoundarySocan
-ICPattern
ICT■IC元件功能
■自動調整
ATE■組裝板功能測試
測試設備的功能及區隔
■IC保護二極體
■靜態測試
■動態測試
-ICT:
In-CircuitTester
-ATE:
AutomaticTestEquipment
-MDA:
ManufactureingDefectAnalyzer
測試步驟
完成
動態
靜態
產品
n自動調整
n組裝板功能測試
-ICBoundaryScan
-ICPattern
nIC保護二極體
nIC元件功能
n元件值
n短路開路
製造不良分佈
高
中
低
空板不良
元件反插
元件不良
功能不良
漏件/錯件
短路/開路
測試成本
不良百分比
高
中
低
空板不良
元件反插
元件不良
功能不良
漏件/錯件
短路/開路
製造不良分佈及測試成本
nOKANON
nTR-518
nTESCON
50K美金以上
nIC保護二極體
n元件值
n短路開路
50K美金以上
nTR-518F
n自動調整
n組裝板功能
nHP
nTERADYNE
-BoundartScan
-Pattern
100K美金以上
nGenRad
nIC元件能
價格
產品
測試功能
測試設備的市場
測試治具
nIn-Line測試治具
n壓合式測試治具
n真空測試治具
n雙面測試治具
n單面測試治具
n加裝”導板”(GuidingPlate)
n正確選擇測試點
n正確選擇測試針頭
n高品質的測試針
治具製作的考慮因素
SMT製造不良問題未來趨勢
開路
短路
漏件/錯件
功能不良
元件不良
元件反插
高
中
低
低
ICPattern
IC保護二極體
元件值
短路
組裝板功能
SMT中
開路
高
產品測試未來趨勢
AOIEQUIPMENT
(AUTOOPTICALINSPECTION)
PerformancestandardsinSM
manpower
inspection
·Drivetoreduce
monitoringand
·Focusonprocess
Scheduledemands
Qualityand
·Lncreasedcost,
Electricalininspection
Process
shipment
assemblyor
System
Manufacturingkeeprisi
Screen
printing
Pickand
place
Reflow
Electrical
test
Single-sideSMTassemblyprocess
andfinerpitchpackag
·Lncreasingboarddens
accesshardertoattail
makein-circuitfixture
·Requirementtoinspec
control
Requirementfor
Fast,high-defect-
coverageinspection
testableelectrically
defectclassesnot
5500-SeriesAOIsystemsfromTeradyneprovide
processmonitoringatanyprocessstep
SMTboardassembly
Lntegration/
Board
Electrical
Thru-
Pick/
Screen
Wave
Packaging
Test
Functional
Test
Process
load
hole
Reflow
Place
Pre-waveinspection
·5515Bsystem
·Bottm-sidesolderjointquality
·Componentinsertion
Post-reflowinspection
·5529,5539systems
·Componentplacement
·Solderjointquality,includingJ-leadsandliftedleads
Single-sideSMTassemblyprocess
·Componentorientation
·Componentpresenceandalignment
·5529system
Postplacementinspection
Thetypicalpost-reflowSMTprocess
Defectspectrum
AOIandICTareoftenemployedtogetheras
Complementarytools
ICT
AOI
Misorienteddevice(cap,
Tombstoned
Lifteleads
Unwettedpins
Deviceprogranmming(flash
Missingdevices
devices
Missingbypasscaps
Skewed/misplaced
Lowsolder
ROM)
MisorientedICs
Billboardeddevices
Devices(stillconnected)
diode)
Devicedefects(e.g.
cracked,IC
Wrongdevices
Shorts
Connectorpins
pins
Openpowerorparallel
Basicdevicefunction
BGAandotherhiddenpins
+Dosenotrequireafixture
Builtboards
+Easilyusedonpartially
Possiblyboardfunction
+Testscomponentfunction,and
+Directsoldering-process
+Cantesthiddenfeatures
+Appliesboardpower
feedback
AOIandICTareoftenemplpyedtogetheras
*不須測試治具
*基本零件之功能裝置
之零件
*BGA零件及其它穩藏腳位
*電氣功能測試(有LIBRARY)
*製程不良之問題
*錯件
ICT
*缺件
*墓碑效應
*零件翹腳
*短路
*LAYOUT設計不良
*零件偏移
*bypass電容
*零件外觀異常
*錫少&錫多
AOI測試之問題:
*不須上電及測試針
*靜態各種外觀材料
AOI
Complementarytools
*須製作治具及加電源
*能夠測試基板內部及穩藏之問題
*能測試零件之功能特性
容易修改
*試產機種或機種少量變更時
*迅速且即時的反應製程問題
The5539-Seriesfivecameraheaddesugn*
Structuredlightrevealsthecontoursoftheobject
Lightintensity
Measuringaverage
lnspection
Solderjoint
Good
Componentbody
underinspection
·Verticalcamera
Lnthesystem:
Inthewindowareaifthe
Comerareadslowlight
·Toplighting
Solderjointisgood
5500-Seriessystemarchitecture
2-4pipelined
framegrabbers*
Dual68040
CPUs,serial
¶llelI/O
Ethernet
VGA
HighaccuracyX-Ytable(0.001”
accuracyover18”x20”boardarea)
3/4HPDCmotors
(29in./smax.tablespeed)
Warp
Strobe
Laser*
(0.6”,0.7”or1.0”FOV)
1or5high-speedcameras
LEDstructuredlightingdome*
Boardunderinspection
Boardstops
*Patentedtechnology
Conveyors(SMEMAinterface)
Windowtypes
detectionwithsubpizellization
Locatesthebrightspotwithinthewindow(peak
Search
intensityacrossthewindow
Measurestheaverage
Presence/AbsenceAverage
Presence/AbsenceVariance
Measurestheaverage
intensityacrossthewindow
100%Variance
0%Variance
Looksforacontinuousbrighstripacrossthe
Bridge
Window,eitherverticallyorhorizontally
Thedefectdetectioncapabilityrequired
Board
Quadflatpack
(QFP)orsmall
OutlineICSOIC
Passives
(0603,0402)
J-leaddevice
Dependsonthedevicepackagingemployed
Board
ComprehensivevisualorAOIsolderjoint
Inspectionrequiresviewingfromanangle
Partial
coverage
defect
Fulldefect
1.J-leaddevice
coverage
2.LiftedleadonaQFP
The5539D+AOI(automatedopticalinspection)
SystemsfromTeradyne
5539D+theoryofoperation
Lmageofacircuitboard
·Compleximagetoprocess
·Hardtoextractthekeydata
Windowapproach
·Structuredlightinghighlightsdefects
·Applysimplecriteriaatcriticalpoints
·Automaticallysimplifiesthranalysis
·Fastreliable
required
Inspectionexpamplesusingdifferentcombinations
ofwindowtypesandlighting
Lightingfromabove
Searchwindow
Componentlocation
Lightingbehindthecamera
Bridgewindows
Soldershortinspection
(圖二)
Sidelighting.(“Snakeeyes”)
Solderjointinspection
Presencewindowsmeasuringvariance
(圖一)
Lightingbehindthecamera
Presencewindow
Componentpresenceinspection
Anexampleofusingstructuredlighttoinspectfor
(圖三)
aboutthesolderjoints
·Difficulttomakeajudgement
·Usedfordefectingsolderbridges
Toplighting
·Solderjointdefectsdefected
(圖一)
(圖二)
·Lowvarianceinthewindow
·Badjoints
Sidelighting
·Highvarianceinthewindow
·Goodjoints
Sidelighting
defectsonfine-pitchQFP
Warpcompensation
Boardwarpagecausestheimagetomoveinthefield
ofviewofanangledcamers
Thebuilt-inwarpmeasurementsystemmeasuresthe
warpandautomaticallycompensatesforitduring
inspection
Warpagemeasurementtechnigue*
Boardwarpagebylookingat
2.thecamerasmeasurethe
thepositionoftheline
acrosstheboardsurface
shinesabrightline
1.angledstrobedlaser
warpage
themeasurementoftheboard
strobedonasrequiredtofreeze
boardsurfacewiththeline
camera/lightingheadoverthe
3.theXYtablemovesthe
ProgramminganAOIsystem
1.CADoutputforpickandplace
2.Creatprogramusing
packagestyle,orientation)
systems(X,Y,designator,
CDES(PCwindows3.1)
andprogramstability
verifydefectcoverage
4.PerformanceCurves
Components)
100%missing
reflowedboard(i.e.
Unpopulated,printed,
PerformanceCurvesareakeytoolforg
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- SMT 测试