ANALYSISTECH半导体微电子热阻导热系数测试仪Word文档下载推荐.docx
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ANALYSISTECH半导体微电子热阻导热系数测试仪Word文档下载推荐.docx
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每加热15秒,测量1次热敏参数,即获得1个结温值,测量完之后继续加热,加热15秒,再次测量结温值,如此反复工作。
在这个过程中,系统将每次测量到的结温值和前面7个结温值进行比较,如果连续8个结温值相同,系统会判定器件达到热平衡,并计算出稳态热阻值。
如果用户需要得到热阻热容曲线,只需要将电子开关锁定在测量端即可。
此时,因为没有了加热电流,器件开始降温,通过监测器件电压可以得到一条温度下降的曲线,进而通过一系列数学变换得到热阻热容曲线以及瞬态热阻抗曲线。
三、AnalysisTechPhase11
Phase10技术指标
Ø
加热电流测量精度(低电流测量:
0.2A,1A和2A测量)
2A系统:
±
1mA,10A系统:
5mA,20A系统:
10mA
加热电流测量精度(高电流测量:
2A,10A和20A测量)
4mA,10A系统:
20mA,20A系统:
40mA
加热电压测量精度:
0.2%读数±
0.025%量程
热电偶测量精度(T型):
典型±
0.1℃,最大±
0.3℃
结温测量精度:
0.1℃
结温测量延迟时间:
1us
设备工作电压:
220VAC,3A,50/60Hz
器件的最大供电电压:
5V(选配PowerBooster可以扩展到100V)
器件的最大供电电流:
2A,10A,20A(选配PowerBooster可以扩展到1000A)
结温的感应电流:
1mA,5mA,10mA,20mA,50mA,0.1~50mA可设定
四、附件介绍
1、Nuova校准浴锅
用来得到节电压和结温的函数关系即K值。
产品特点:
1)由集成在热阻分析仪中的模块直接进行温度控制
2)使用有陶瓷镀层的磁力搅拌器
3)带有冷却风扇的坚固底盘能够控制升温速率并保证安全性
4)有盖的四升不锈钢水浴锅
5)悬挂结构支持部件被校准
6)四升绝缘良好的导热矿物油,对环境无害并能重复使用
2、EVN-12静止空气测试箱
EVN-12是用于在标准化的静止空气环境中测试元件。
自然对流条件下的热阻测量会对实验室里的不期望的空气流动非常敏感。
这套静止空气测试箱可以排除这种潜在的产生测试错误的因素。
3、风洞
相对于静止空气测试箱,伺服控制风洞提供了一个强制对流、均匀一致的测试环境。
在测试对气流比较敏感的器件时,我们能够更加准确地测量出器件在不同风速下的热阻。
4、Rjc测试夹具(风冷型)
风冷型Rjc测试夹具是一个高性能的风冷型热沉,可以很方便地固定被测器件,是测量JEDEC标准定义Rjc的理想夹具。
Rjc测试夹具采用了一种特殊的装置可以准确的测量壳温。
5、Rjc测试夹具(水冷型)
水冷型Rjc测试夹具需要配合循环冷水机使用,具有散热迅速的特点,通常用来测试IGBT和MOSFET等功率较大的器件。
6、R测试夹具
完全按照JEDECJESD51-8的要求设计,用来测试结到电路板的热阻。
7、LED高压放大器
当被测LED的正向压降高于5V,可以选择LED高压放大器,提供28V的测试电压。
8、功率放大器
提供高达200A,400A和1000A的加热电流。
9、热阻分析仪校准仪
溯源到NIST,可以用于热阻分析仪的故障诊断,建议每半年对热阻分析仪做一次校准。
10、热电偶校准仪
溯源到NIST,用于对热电偶接口进行校准。
五、AnalysisTechPhase11
主要特色
所有测试数据、图像全屏显示
高速数据采集和分析,能对各种类型器件进行测试
能够输出常规的数据和文件类型,能将设置参数和数据存储在硬盘上
能对操作人员的错误和测试数据的有效性进行连续监测
四线制测试方法排除测试导线电阻的影响
兼容IEEE488和RS-232C通讯方式,测试方法遵循MIL&
JEDEC标准
根据电流、功率或ΔTj对器件的功率进行自动控制,用户选择热平衡的监测方法
对附属设备进行自动控制,对集成电路和多芯片模块有多结探测能力
三个内部参考热电偶,能通过红外线对器件表面的温度进行测试
有标准和常规的测试夹具,设备校准方便
AnalysisTechThermalAnalyzersmeasuresemiconductorjunctiontemperaturesusingtheelectricmethodofjunctiontemperaturemeasurementfortestingalltypesofsemiconductordevices.Thiscapabilityisthefoundationofnumeroustestmethodsincluding:
thermalresistance,transientthermalimpedance,dieattachscreeningandfunctionalpowercycling.Theconvenientflexibilityoftheanalyzeralsofacilitatesinterconnectedcontrolofotherlaboratorytestequipment.
SemiconductorThermalAnalyzers
performthermalmeasurementsonalltypesofpackagedsemiconductordevicesincludingdiodes,LEDs,bipolartransistors,MOSFETs,functionalanalog/digitalintegratedcircuits,ACSICS,IGBTs,SCRs,TRIACs,andthermal-test-dies.AllproductsofferedconformtoapplicableJEDECandMILStandards.Usingtheelectricalmethodofjunctiontemperaturemeasurement,AnalysisTechThermalAnalyzersaccuratelymeasureponentthermalparameters-essentialfordesignandimplementationofthermallyreliableelectronics.Inadditiontoequipmentsales,AnalysisTechoffers
ponentTestServices
forthermalcharacterizationofsemiconductordevicesatourfactorytest-laboratory.
Thistypeoftestequipmentisalternatelyknownas:
semiconductorthermalresistancetesters,semiconductorthermalimpedancetesters,ponentthermalresistancetesters,ponentthermalimpedancetesters,dieattachtesters,dieattachmenttesters.
TheAnalysisTech
ThermalAnalyzerPhase11
providesprehensiveautomatedcontrolofsemiconductorthermalmeasurementsforproductionanddevelopmenttestingwithpowerfulfeaturessuchas:
AllTestModes:
▪
Testcapabilitiesforalldevice-types:
diodes,LEDs,bipolars,MOSFETs,IGBTs,functionalICs,thryistors,thermaltestdies
Automatedhighspeeddatacollection,reduction,andanalysis
patiblewithall750EMilStdsandJEDEC51Seriesmethods
Dataplotsforalltestparametersinalltestsmodes
Simple,automated"
in-lab"
instrument-calibrationprocedures
Varioustextandgraphicsfileformatsforconvenientexporting
Continuousintelligentmonitoringforerrorsanddatavalidity
Kelvin(4-wire)connectionstoeliminatetestcableresistanceseffects
patibilitywithUSB,IEEE488,andRS-232Cmunications
10/100EthernetNICinterface
TestmethodspatiblewithMIL&
JEDECteststandards
Selectionofautomaticpower-controlbycurrent,wattage,andΔTj
Standardandcustomtestfixturingavailable
WindowsXPProoperatingsystem
SteadyStateThermalResistanceMode:
Multi-junctiontemperaturesensingcapabilityforICs&
multi-diedevices
User-selectablethermalequilibriumcriteria
Batch-modefordeterminingpowerlevelandairfloweffects
Controlofaccessorylaboratoryequipmentforintegratedtesting
Infraredcasetemperaturemeasurementcapability
Capabilityforautomaticallyswitchingthedeviceundertest
DieAttachorPowerPulseMode:
Pass/Failorbinsortingbasedondie-attachquality
Serializedparttesting
Dataplotsofallparametersincluding
die-attachhistogram
Extended-lifetestingwithintersperseddie-attachtesting
Interfaceformechanizeddevicehandlers
Batchmodedie-attachmentproductiontestingmulti-chipmodules
HeatingCharacterization/TransientThermalImpedanceMode:
Heatingandcoolingcurvetime-resolution:
1microsecond
Heatingandcoolingcurvespan:
1microsecond-10,000seconds
Heatingandcoolingcurvepoints-per-decadeplotted:
15
Utilizestime-constant-spectrumandstructurefunctionanalyses
OptimizedpactdynamicRCmodelswith2-8discretestages
MultipleSense-JunctionChannelsUptoeightjunctiontemperaturescanbesimultaneouslysensedfortestingdeviceswithmultiplejunctions
andforcharacterizingmulti-chippackagesormodules.Inmultiple-diepackages,thedie-to-dieheating
(thermalcross-coupling)mustbemeasuredtoaccuratelycharacterizethesetypeofpackages.Fortesting
functionalintegratedcircuits(ICs),multiplesensejunctionsoffervalidationofthejunctiontemperature(Tj)
readingsininstanceswheresomeoftheTjsenseconnectionsaresubjecttothespuriouselectricaleffects
ofotherportionsoftheICcircuitry.Whentestinghybridsandlarge-dieICs,multiplesensejunctionscan
revealtemperaturedistributionsthatoccurwhensubstantialtemperaturevariationsexistwithinthetestdevice.
Multiplesensechannelapplicationsinclude:
Multi-diedeviceswheremultipleheatsourcesmayexist
Thermalcross-couplingassociatedwithmulti-chipdevices
Largerdeviceswhichmayexhibitsubstantialtemperaturegradientsduringnormalpoweredoperation
Multiplesensechannelsalsopermitthecalibrationofupto8sensejunctionssimultaneouslyforfastercalibrationthrough-put.
BatchModeandBinSortingforPowerPulseTestingAccurateandrapidscreeningofdevicethermalcharacteristicscandramaticallyenhanceproduction-device
reliability.DieAttachmenttestingprovidesanexcellentgaugeofthechipattachment-qualityintermsofthe
deviceimpedance.ThePhase11ThermalAnalyzerprovidesprogrammablerelaydriversforcontrolling
externaldevicesduringPowerPulseTesting.Thesedriversofferthefollowingcapabilities:
switchingbetweentestpointsinhybridcircuittestfixturesformultiplesequencedtests
manualorautomatichandlercontrols
binsortingbasedondieattachment
testresults
ThetestswitchingcapabilityoftheThermalAnalyzerallowsonetestfixturetocarryallthetestconnectionsor
test-pointprobesforabatchoftestsrequiredfortestingplexhybrids.Thusallsignificantdieattachments
onahybridcanbetestedwithoneinsertionandonetestinitiation.
Binsortingisutilizedindieattachtestingtorapidlysortdevicesbasedondie-attachmentquality.Thebin
sortingcontrolcanbeusedwithmanualinsertiontestingorwithautomaticponenttransfersystems
whichwouldinsertdevicestobetestedintotestfixturesandsubsequentlyejectthetesteddeviceintoone
ofuptoeightbins.(see
DieAttachTestinginProductionEnvironments)
AccessoryEquipmentControlPortsFrequently,devicethermalperformancemustbeevaluatedoverarangeofexternalconditions.Suchconditions
mightincludecoolingairflow,ambientoperatingtemperature,coolantflowrate,ortheheatingsupplyvoltage.
TheThermalanalyzercancontrolaccessorytestequipmentviaUSB,IEEE,orserialmunicationto
achieveintegratedbatchtestingunderawiderangeofexternalconditions.TheAnalysisTechaccessory
BatchSwitchingModuleprovidesaconvenientmeanstoswitchthedevice-under-testsothatmanydevices
canbetestedsequentiallyinbatchmode.
ThesimplesetupandcontrolproceduresoftheThermalAnalyzersallowthetestengineertoinitiateupto
200testsinbatchmode.Testsaresuccessivelyexecutedautomatically:
asatestreachespletion,
theexternalconditionisincrementedandthetestcyclerepeateduntilthebatchoft
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