1、电子行业专业词汇术语专业超全电子行业专业词汇术语全）（专业超电子行业专业词汇术语GRR Gauge Repeatability Reproducibility 量测的再现性与再生性FPI First Piece Inspection 首件检查Sampling without replacement 不放回抽样 SQA: Source(Supplier) Quality Audit 供货商品 质审核1.QC : quality control 质量管理2.IQC : incoming quality control 进料质量管理3.OQC : output quality control 出货质
2、量管理4.PQC : process qualitycontrol 制程质量管理 也称IPQC : in process quality control .5.AQL : acceptable quality level 允收标准6.CQA: customer quality assurance 客户品 质保证7.MA : major defeat 主要缺点8.MI : minor defeat 次要缺点9.CR :critical defeat 关键缺点10.SMT : surface mounting technology表面粘 贴技术11.SMD :surface mounting de
3、vice 表面粘贴程SMC : surface mounting component 表面 粘贴组件12.ECN : engineering change notice 工程变更 通知13.DCN : design change notice 设计变更通知14.PCB : printed circuit board 印刷电路板15.PCBA : printed circuit board assembly装配 印刷电路板16.BOM : bill of material 材料清单17.BIOS : basically input and output system 基 本输入输出系统18.MI
4、L-STD-105E : 美国陆军标准，也称单次抽 样计划.19.ISO : international standard organization 国际标准化组织20.DRAM:内存条 21. Polarity :电性22.Icicles:锡Non- wettin g :空焊24. Short circuit :短路25. Missing comp onent: 缺件26.Wrong comp onent: 错件27 . Excess component :多 件28. Insuff icient solder 锡少29 . Excessivesolder :锡多 residue:锡渣30.
5、 Solder31. Solder ball :锡球 32.Tombstone :墓碑33 . Sideward:侧立 34.Component damage 零件破损35. Gold finger:金手指 36. SOP :standard operation process 标准操作流程37. SIP : standard inspection process 标准检验 流程38 . The good and not good segregation 良品和 不良品区分39. OBW : on board writer 熸录 BIOS40 . Simple random sampling
6、:简单随机抽样41. Histogram :直方图42 . Standard deviation :标准差43.CIP : Continuous improvement program持续改善计划44.SPC : Statistical processcontrol 制程统制45 . Sub-contractors :分包商46.SQE: Supplier quality engineering47.Sampling sample 抽样计划48.Loader :治具 49.QTS: Quality tracking system 质量追查系统50. Debug :调试Spare parts:备
7、用品52.Inventory report for :库存表53.Manpower/Tact estimation 工时预算54. Calibration :校验55. S/N :serial number 序号56. Corrugated pad :波纹垫57. Takeout tray:内包装盒58. Outer box : 夕卜包装箱59. Vericode :检验码60. Sum of square :平方和61. Range :全距62. Conductive bag :保护袋63. Preventive maintenance 预防性维护64. Base unit : 基体65.
8、Fixture :制具66. Probe : 探针67. Host probe :主探针68. Golden card : 样 本卡69. Diagnostics program :诊断程序70. Frame : 屏面71 .Lint-free gloves :静电手套72 . Wrist wrap73.Target value :目标值74.Related department :75 .lifted solder 浮焊76.plug hole77.Wrong direction 极性反ponent damage or broken 零件破损 79 .Unmelted solder熔 锡不良
9、80.flux residue 松 香 未81.wrong label or upside down labe贴占反82.mixed parts 机83.poor solder mask录漆不良84.oxidize 零85.stand off height浮 高86.ICIC reverse87.组作业指导 擦 除 内部联络单supervisor课长88.Forman89.Wl=work instruction90.B.P. 非91.:Quality policy 质Internal notification:92.QP93.QT: Quality target 品质目标94.Trend: 推
10、 移 图95.Paret柏拉图96.UCL: Upper control limit 管制上限 97LCL:Lower control limit 管制下限98.CL: Center line 中 心 线99.R.T. Rolled throughout yield 直通率100.PPM: Parts per million 不良率101.DPU: Defects per unit 单位不良率102. Resistor:电阻103. Capacitor:电容104. Resistorarray: 排阻105. Capacitor array:排容106. DIODE: 二极管107 .SOT:
11、三极管108. Crystal:震荡器109 .Fuse保险丝110. Bead: 电感inductance111 .Connector联结器112 .ADM: Administration Department 行政单位113.CE: Component Engineering零件工程114.CSD :Customer Service Departmen 客户服务部 115 .ID: Industrial Design 工业设计116.IE: Industrial Engineering 工业工程117.IR: Industrial Relationship 工业关系118.ME: Mech
12、anical Engineering 机构工程119.MIS :Management Information System信 息部 120. MM: Material Management 资材121.PCC: Project Coordination/Control 专案协 调控制122.PD: Production Department 生产部123.PE: Product Engineering 产品工程124.PM: Product Manager 产品经理 125.PMC: Production Material Control 生产物料管 理126.PSC: Project Sup
13、port & Control 产品协调127.Magnesium Allo y 镁合金128.Metal Shearing 裁剪129.CEM:Contract Electronics Manufacturing 电子制造服务企业EMS: Electronics Manufacturing Services130.ERP: Enterprise Resource Planning 企业 资源规划SCM+CRM+ERP+EAI=Network directTM links procurement, production, Logisticsand sales采购，生产，后勤管理及市场营销的融合E
14、AI: Enterprise application Integration 企业应用系统整合CRM: Customer Relationship Planning 客户服务规划SCM : Supply chain management 供应链 管理131.OJT: On job training 在职培训132.Access Time:光盘搜寻时间133.B2CEC:Business to consumer electronic commerce企业对消费者的电子商务B2BEC:Business to business electronic Commerce 企业间的电子商务 134CCL:
15、Copper Clad Laminate 铜箔基板 135 .I ntranet:企业内部通讯网路136.ISP: Internet Service Provider 网络服务提 供者ICP: Internet Content Provider 网络内容 提供者137.GSM: Global System for Mobile Communication泛欧数字式行动电话系统GPS:全球卫星定位系统138. Home Page: 网络页139 .Video Clip:影像文件140. HTML: 超文 标记语2言141 .Domainname:网域名称142. IP: 网络网域通讯协议地址14
16、3N otebook笔记型计算机144.VR: Virtual Reality 虚拟实境145.WAP: Wireless Application Protoco无 线应 用软件协议146 .LAN : Local area network 局域网络WW World Wide Web 世域网WAN: Wide Area Network 广域网络147. 3C: Computer, Communication, Consumer electronic计算机，通讯，消费性电子三大产品 的整合148.Information Supplier Highway:信息高速公 路149.UPS:Uninte
17、rrupted power system 不断电系统 150 .Processed material:流程性材料151.Entity/Item: 实 体152.Quality loop 质量环153.Quality losses: 质 量 损 失154.Corrective actio n 纠正措施155.Preventive action:预防措施156.PDCAlan/Do/Check/Action 计戈U/实施/检查/ 处理157.Integrated circuits(IC):集成电路158.Application program:应用程序159.Utilities: 实 用 程 序1
18、60.Auxiliary storage/Second storage 辅助存储 器161.Silicon chip: 硅 片162Diskette drive 软驱163. Display screen/Monitor:显 示 器164.Foreground 前面165.M ontherboard: 母 板166.Mermory board:内存板167 .Slot: 插 槽168.Busata-bus/address-bus/Controbus:总线 / 数据总线/地址总线/控制总线169.Plotter: 绘 图仃0.MPC:Multimedia personal computer 多媒
19、 体171.0 scillator: 振 荡 器仃2.Automatic teller terminal:自动终端（出纳）机 仃3. Joystick port: 控 制 端 口仃4.VGA: Video Graphics Array 显示卡 仃5. Resolution: 分 辨 率仃6. Register寄 存器仃7.ISA: Industry Standard Architecture 工业 标准结构仃8.EISA: Extended Industry Architecture 扩 展工业标准结构 179.Adapter:适配器180.Peripheral: 外 部 设 备181.Fax
20、modem调制解调器181 .NIC:Network interface card 网络接口卡 182. SCSI: Small computer system interface 183 .VESA: Video Electronic StandardsAssociation184. SIMM: Single in-line memory module 单排 座存储器模块（内存条）185.Casing外箱186. Aluminum:铝质 187 .Ceramic:陶瓷的 188 .Platter:圆盘片189. Actuator:调节器 190 .Spindle 轴心191 .Actuati
21、on arm:存取臂192.Default code:缺省代码 193.Auxiliaryport:辅助端口 194.Carriage return :回车195 .Linefeed 换行 197 .Video analog:视频模拟196. ASCII: American Standard Code forInformation Interchange美国信息互换标准代 码198.TTL: Transistor- Transistor logic 晶体管-晶 体管逻辑电路199 .Three-prong plug:三芯电插头200.Female connector连接插座201 .Flopp
22、y disk: 软 盘202.0utput level:输出电平203.Vertical/Horizontal synchronization:场/行 同步 204.H (Horizontal)-Phase:行相位205. Compatible: 兼 容 机206.H ardware Expansion Card:硬件扩充卡207.Buffer: 缓 冲208.CRM:Customer relationship Management 客户关系管理209. WIP: Work in process 半成品210 .Waiver:特别采用211 .CXO 系列一CEO: Chief Executi
23、ve Office 首席执政官；执行总裁COO: Chief Operating OfficeCFO: Chief Finance OfficerCBO: Chief Business OfficerCTO: Chief Technology OfficerCIO: Chief Information OfficerCGO: Chief Government Officer212. NASDAQ: 纳斯达克证券市场NASDAQ Automated Quotation system213 .VC: Venture Capital 风险投资214.PDA: Personal Date Assist
24、ant个人数字助 理PLA: Personal Information Assistant 个人 信息助理215.PPAP: Advanced Product Quality Planningand Control Plan 生产性零组件核准程序216.FMEA: Potential Failure Mode and EffectsAnalysis 失效模式与效应分析217.MSA: Measurement Systems Analysis量测 系统分析218.QAS: Quality System Assessment质量系统评鉴 219. Cusum:累计总合图220.Overall Eq
25、uipment Effectiveness设备移动 率221.Benchmarking:竞争标杆 Analysis ofmotion/Ergonomics动作分析/人体工程学222.MCR:Roka Yoke 防错法 machine capability ratio 机器利用率223.Mistake Proofing Taguchi methods田 口式方法224.Vertical integration Surveillance定期追踪审查225.ManufacturingEMS: ElectronicsSupply-chain226.Cause & Effects charts特 性要因
26、图227.Scatter:散布图 Fool-ProofSystem防呆系统228.VE: Value Engineering 价值工程 QFD: Quality Function Development 质量机能展开229.Arrow Chart 箭头图法 AffiliateChart亲和图法230.PDPC: Process Decision Program Chart System Chart系统图法231.Relation Chart 关边图法 MatrixChart矩阵图法232.Matrix Data Analysis 矩阵数据分析法234.Brain-storm 脑风暴法 JIT:
27、 Just InTime:及时性生产模拟235.Deming Prize:戴明奖 Prototype 技术试作236.BPM: Business Process Management 业务流程管 MBO目标管理237.MBP:方针管理 FTA:故障树分析QSC 服务质量238.IPPB: Information 情况 planning 策划 Programming 规划 Budget 预算239.EQ: Emotion Quotient:情商IQ: Intelligence Quotient:智商240.Implied Needs:隐 含 要 求 Specified Requirement规定
28、要求241.Probation:观察期 IncomingProduct releasedfor urgent production 紧急放 行242.Advanced quality planning 先进的质量 策划243.AOQ: Average Outgoing Quality 平均检出 质量AOQL: Average Outgoing Quality Limit平均检出质量界限244.经核准认可的供Approved Supplier List应商名单Benchmarking 基准点准特 征Calibration 校246.Capable process 工序能力 Capability
29、Index序能力指数 Capability ratio工序能力 率247.CHANG CYCLE TIME 修改的时间周期 Continuous improvement 持续改进248.Control plans 控 制 策 划 Cost of quality 质量成本249.Cycle time reduction减少周期时间250.Design of experiments 实验设计 Deviation / Substitution 偏差 / 置换251.ESD: Electrostatic discharge静 电释放252.EH&S: Environmental, Health, an
30、d Safely 环境，健康.安全253.ESS: Environmental Stress Screening 环境 应力筛选254.FMEA: Failure Mode Effect Analysis 失 误模式效应分析255.First Article approval 产品的首次论证256.First pass yield 一次性通过的成品率257.First sample inspection第 一次样品检验258.FMECA: Failure mode effect and criticallyanalysis失误模式，效应及后果分析259.Gauge control测量仪器控制260.GR&R: Gauge repeatability andreproducibility测量仪器重复性和再现性261.HALT: Highly Accelerated Life Test 高力口 速寿命试验262.HAST: Highly Accelerated Stress Test 高加速应力
